
Reference MVI69-PDPMV1 ♦ CompactLogix or MicroLogix Platform
User Manual PROFIBUS DPV1 Master
Page 158 of 225 ProSoft Technology, Inc.
July 8, 2011
6.1.1 General Specifications
Single-slot, 1769 backplane-compatible
The module is recognized as an Input/Output module and has access to
processor memory for data transfer between processor and module.
Ladder Logic is used for data transfer between module and processor. A
sample ladder file with AOI is included.
Configuration data obtained from configuration text file downloaded to
module. A sample configuration file is included.
Supports CompactLogix and MicroLogix 1500 LRP processors with 1769 I/O
bus capability and at least 800 mA of 5 Vdc backplane current.
CIPConnect
®
enabled. Module supports communications with ProSoft
Configuration Builder and FDT comDTM via Ethernet routing using Rockwell
Automation Ethernet interface.
CIPConnect
®
currently supports only L32E and L35E CompactLogix
processors.
6.1.2 Hardware Specifications
Specification Description
Dimensions Standard 1769 single-slot module
Current Load 800 mA max @ 5 Vdc
Power supply distance rating of 2 (L43 and L45
installations on first 2 slots of 1769 bus)
Operating Temp. 0°C to 60°C (32°F to 140°F)
Storage Temp. -40°C to 85°C (-40°F to 185°F)
Relative Humidity 5% to 95% (with no condensation)
LED Indicators Power and Module Status
Application Status
Serial Port Activity
Serial Activity and Error Status
CFG Port (CFG) RJ45 (DB-9M with supplied cable)
RS-232 only
CIPconnect
®
Ethernet routing when using 1769-
L32E or 1769-L35E
Shipped with Unit RJ45 to DB-9M cables for each port
6-foot RS-232 configuration cable
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